INTERFACE MODIFICATION OF POLYCRYSTALLINE DIAMOND COMPACT

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United States of America Patent

SERIAL NO

13673440

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Abstract

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A cutting element and a method of providing the cutting element are provided. The cutting element may comprise a substrate, a first polycrystalline diamond zone, and a second polycrystalline diamond zone. The first polycrystalline diamond zone may have substantially free of a catalyst material. The second polycrystalline diamond zone rich in the catalyst material may be bonded to the substrate along an interface. The second polycrystalline diamond zone may be bonded to the first polycrystalline diamond zone along an effective transition zone. The effective transition zone may have a plurality of irregular projections toward the first polycrystalline diamond zone and the second polycrystalline diamond zone.

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Patent Owner(s)

Patent OwnerAddress
DIAMOND INNOVATIONS INC6325 HUNTLEY ROAD WORTHINGTON OH 43085

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gledhill, Andrew Westerville, US 27 102

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