METHOD FOR VERIFYING CORRECT ADHESION OF A SUBSTRATE ON AN ELECTRICALLY AND THERMALLY CONDUCTIVE BODY
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United States of America Patent
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app pub date -
Jun 6, 2012
filing date -
Jul 5, 2011
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Abstract
A method of verifying a correct adhesion of a substrate on a body which is configured to be electrically conductive and thermally conductive includes providing the body, providing the substrate comprising a top face and a rear face, connecting to the top face of the substrate an electric circuit comprising conductive paths and electronic components, attaching to the rear face the body via an adhesive layer comprising an adhesive, connecting the conductive paths and the body to an respective opposite terminal of a voltage source via contact tabs, measuring a capacity, and determining a quality of the adhesive layer from the measured capacity.
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