MULTI-CHIP MODULE CONNECTION BY WAY OF BRIDGING BLOCKS
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United States of America Patent
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Issued Date -
May 15, 2014
app pub date -
Nov 13, 2012
filing date -
Nov 13, 2012
priority date (Note) -
Abandoned
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Abstract
One aspect provides an integrated circuit (IC) multi-chip packaging assembly, comprising a first IC chip having packaging substrate contacts and bridging block contacts, a second IC chip having packaging substrate contacts and bridging block contacts, and a bridging block partially overlapping the first and second IC chips and having interconnected electrical contacts on opposing ends thereof that contact the bridging block contacts of the first IC chip and the second IC chip to thereby electrically connect the first IC chip to the second chip.
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