Thin film processing apparatus
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United States of America Patent
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Issued Date -
May 15, 2014
app pub date -
Nov 13, 2012
filing date -
Nov 13, 2012
priority date (Note) -
Abandoned
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Abstract
A thin film processing apparatus assembles a substrate and an auxiliary plate tightly and the substrate is coated with a thin film whereon the auxiliary plate is situated. Since the substrate or the auxiliary plate is transparent for thermal radiation, the thin film heated by thermal radiation symmetrically in thickness direction will be available. Consequentially debonding, warping and cracking of thin film are thus prevented and outgassing from thin film is eliminated as well.
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