Stamp structures and transfer methods using the same

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United States of America Patent

PATENT NO 9630440
SERIAL NO

14078763

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Abstract

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A stamp structure includes a stamp frame having a plate part. The plate part includes a plurality of holes. The plurality of holes are configured to facilitate the adsorption of an object to the plate part during a transfer of the object from a donor substrate to a target substrate.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nam, Yun-Woo Seongnam-si, KR 19 240
Yang, Ki-yeon Seongnam-si, JP 6 11

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