HIGH POWER IMPULSE MAGNETRON SPUTTERING METHOD PROVIDING ENHANCED IONIZATION OF THE SPUTTERED PARTICLES AND APPARATUS FOR ITS IMPLEMENTATION
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United States of America Patent
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Issued Date -
May 8, 2014
app pub date -
Apr 16, 2012
filing date -
Apr 20, 2011
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Abandoned
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Abstract
Method for performing a HIPIMS coating process, whereby a minimal distance 5 between target and substrate is reduced till achieving an essentially maximal bias current at substrate during coating process, and thereby improving considerably coating quality and increasing deposition rate in comparison with conventional HIPIMS coating processes.
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