Solder joint structure and solder joining method
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United States of America Patent
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May 31, 2016
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N/A
app pub date -
Sep 12, 2013
filing date -
Nov 7, 2012
priority date (Note) -
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Abstract
A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface.
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