MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE
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United States of America Patent
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Issued Date -
May 8, 2014
app pub date -
Jan 14, 2014
filing date -
Dec 22, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.
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