CMP PAD CONDITIONERS WITH MOSAIC ABRASIVE SEGMENTS AND ASSOCIATED METHODS
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Mar 18, 2013
filing date -
May 16, 2005
priority date (Note) -
Abandoned
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Abstract
A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.
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