Plating Process to Increase Coin Blank Surface Hardness
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 1, 2014
app pub date -
Jun 12, 2012
filing date -
Jun 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
A method is for plating metal or alloy blanks. The method includes heating the metal or alloy blanks at a recrystallization temperature sufficient to soften the steel for minting; plating the softened metal or alloy blanks with one or more layers of metal or alloy; and heating the plated blanks at a temperature sufficient to reduce plating stresses but below the recrystallization temperature of the outermost plating layer.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
KR | B1 | KR101395679 | May 25, 2012 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PATENT SPECIFICATION | POLYMER COMPOSITION AND PHOTORESIST COMPRISING THE POLYMER | May 15, 2014 | |||
EP | A1 | EP2721194 | Jun 12, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION PUBLISHED WITH SEARCH REPORT | A PLATING PROCESS TO INCREASE COIN BLANK SURFACE HARDNESS | Apr 23, 2014 | |||
WO | A1 | WO2012171120 | Jun 12, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT | A PLATING PROCESS TO INCREASE COIN BLANK SURFACE HARDNESS | Dec 20, 2012 | |||
CA | A1 | CA2839465 | Jun 12, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
APPLICATION LAID OPEN | A PLATING PROCESS TO INCREASE COIN BLANK SURFACE HARDNESS | Dec 20, 2012 | |||
CN | A | CN103635606 | Jun 12, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
UNEXAMINED APPLICATION FOR A PATENT FOR INV. | Plating process to increase coin blank surface hardness | Mar 12, 2014 | |||
PH | B1 | PH12013502588 | Jun 12, 2012 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
Certificate of Addition | A PLATING PROCESS TO INCREASE COIN BLANK SURFACE HARDNESS | Dec 11, 2020 | |||
TW | A | TW201311928 | Jun 14, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
LAID OPEN APPLICATION FOR PATENT OR PATENT OF ADDITION | A plating process to increase coin blank surface hardness | Mar 16, 2013 | |||
AR | A1 | AR086973 | Jun 18, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
INDEPENDENT PATENT APPLICATION | METODO PARA ENCHAPAR COSPELES DE METAL O ALEACION Y COSPEL DE ACERO ENCHAPADO | Feb 05, 2014 | |||
UY | A | UY34143 | Jun 18, 2012 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
PATENT APPLICATION | PROCESO DE ENCHAPADO PARA AUMENTAR LA DUREZA DE LA SUPERFICIE DE COSPELES | Jan 03, 2013 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MONNAIE ROYALE CANADIENNE/ROYAL CANADIAN MINT | OTTAWA ONTARIO K1A 0G8 |
International Classification(s)

- 2012 Application Filing Year
- C22F Class
- 173 Applications Filed
- 143 Patents Issued To-Date
- 82.66 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Nguyen, Toan Dinh | Ottawa, CA | 4 | 88 |
# of filed Patents : 4 Total Citations : 88 | |||
Truong, Hieu Cong | Ottawa, CA | 6 | 11 |
# of filed Patents : 6 Total Citations : 11 | |||
Weber, Dennis Herman | Johnson City, US | 1 | 0 |
# of filed Patents : 1 Total Citations : 0 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- C22F Class
- 0 % this patent is cited more than
- 11 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 1, 2025 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
