Plating Process to Increase Coin Blank Surface Hardness

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United States of America Patent

APP PUB NO 20140120372A1
SERIAL NO

14126362

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Abstract

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A method is for plating metal or alloy blanks. The method includes heating the metal or alloy blanks at a recrystallization temperature sufficient to soften the steel for minting; plating the softened metal or alloy blanks with one or more layers of metal or alloy; and heating the plated blanks at a temperature sufficient to reduce plating stresses but below the recrystallization temperature of the outermost plating layer.

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Patent Owner(s)

Patent OwnerAddress
MONNAIE ROYALE CANADIENNE/ROYAL CANADIAN MINTOTTAWA ONTARIO K1A 0G8

International Classification(s)

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  • 2012 Application Filing Year
  • C22F Class
  • 173 Applications Filed
  • 143 Patents Issued To-Date
  • 82.66 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20122013201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nguyen, Toan Dinh Ottawa, CA 4 88
Truong, Hieu Cong Ottawa, CA 6 11
Weber, Dennis Herman Johnson City, US 1 0

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  • 0 Citation Count
  • C22F Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges284941101 - 1011 - 2021 - 3031 - 4002.557.51012.51517.52022.52527.53032.53537.54042.54547.55052.5

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