Plating Process to Increase Coin Blank Surface Hardness
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Jun 12, 2012
filing date -
Jun 17, 2011
priority date (Note) -
Abandoned
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Abstract
A method is for plating metal or alloy blanks. The method includes heating the metal or alloy blanks at a recrystallization temperature sufficient to soften the steel for minting; plating the softened metal or alloy blanks with one or more layers of metal or alloy; and heating the plated blanks at a temperature sufficient to reduce plating stresses but below the recrystallization temperature of the outermost plating layer.
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