DECORATION FILM, DECORATED MOLDED DEVICE AND DECORATION MOLDING PROCESS
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Nov 28, 2012
filing date -
Oct 26, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A decoration film, a decorated molded device, and a decoration molding process are provided. The decoration film includes a carrier layer; a releasing layer disposed on the carrier layer; a protection layer, wherein the releasing layer is located between the protection layer and the carrier layer; a decoration pattern layer disposed on the carrier layer; an impact resisting layer disposed on the carrier layer; an adhesion layer disposed on the carrier layer, wherein the total film thickness of the adhesion layer and the impact resisting layer is 2 μm to 20 μm and the impact resisting layer and the decoration pattern layer are located between the protection and the adhesion layer.
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