CHIA SEED COMPOSITION
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Dec 11, 2013
filing date -
Jan 11, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A composition of matter includes a shelf-stable, partially defatted supercritical CO2 fluid solvent extracted whole grain flour derived from Salvia hispanica L. whole ground seed and that is free of cyanogenic glycosides, vitamin antagonists, and gluten. The flour includes minerals, about 25-35% protein, about 5-8% wt/wt of about 3.0-3.3:1 mixture of ALA to LA native seed oil, and about 48-60% insoluble fiber. The flour exhibits pH dependent thixotropic properties when mixed with water.
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