ELECTRONIC DEVICE
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United States of America Patent
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N/A
Issued Date -
May 1, 2014
app pub date -
Nov 30, 2012
filing date -
Oct 25, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic device includes a first shell, a heat source and a heat dissipation module. The first shell includes an upper shell element and a lower shell element. The heat source is located on the lower shell element. The heat dissipation module includes a heat guide pipe. The heat guide pipe has a first side surface and a second side surface opposite each other. The second side surface is in contact with the heat source. The first side surface is in contact with the upper shell element.
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