EPHEMERAL BONDING
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Oct 25, 2012
filing date -
Oct 25, 2012
priority date (Note) -
Abandoned
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Abstract
Compositions suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate, are disclosed. Methods of temporarily bonding two surfaces, such as the active side of a wafer and a substrate using the compositions disclosed herein are also provided.
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