PRESSURE RELIEF FOR ADHESIVE DISPENSING SYSTEM
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Dec 5, 2012
filing date -
Oct 25, 2012
priority date (Note) -
Abandoned
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Abstract
A hot melt system is described which includes a container of hot melt pellets, a melter, a feed system, a pump, and a dispensing system. A pressure relief system is built around the pump, which may redirect liquefied adhesive from the pump outlet to the pump inlet.
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