APPARATUS AND METHOD FOR SPUTTERING A TARGET USING A MAGNET UNIT
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Oct 2, 2013
filing date -
Oct 26, 2012
priority date (Note) -
Abandoned
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Abstract
A sputtering apparatus and method are disclosed which can reduce deviations in the deposition thickness on the target object. The sputtering apparatus may include a chamber body and a targeting module. The targeting module may be positioned inside the chamber body and may include a source and at least one magnet unit, where the magnet unit may be configured to generate a magnetic field. Here, the magnet unit can be made to swing during a sputtering process.
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