HEAT-CONDUCTING STRUCTURE AND HEAT EXCHANGER AND HEAT-EXCHANGING SYSTEM USING THEREOF
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Oct 25, 2012
filing date -
Oct 25, 2012
priority date (Note) -
Abandoned
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Abstract
A heat-conducting structure comprises a heat-conducting metal layer, a heat-conducting support layer, and a heat-conducting protection layer. The heat-conducting support layer is formed to enclose the heat-conducting metal layer thereby preventing the heat-conducting metal layer from thermal deformation, while the heat-conducting protection layer is formed to enclose the heat-conducting support layer. In another embodiment, the heat-conducting structures are utilized to form a heat exchanger or a heat-exchanging system comprising a heat-absorbing zone and a heat-dissipating zone, whereby a high-temperature fluid is guided to flow through the heat-absorbing zone for transmitting the heat to the heat-conducting structures within the heat-absorbing zone through heat convention and the heat-exchanging structures conducting the heat to the heat-dissipating zone such that a low-temperature fluid passing therethrough can absorb the heat dissipated from the heat-exchanging structures within the heat-dissipating zone and transmit the heat energy out of the heat exchanger or the heat-exchanging system.
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