HEAT DISSIPATION DEVICE AND HEAT DISSIPATION FINS THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140116659A1
SERIAL NO

13759415

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat dissipation device for being in thermal contact with a heat source includes multiple heat dissipation fins, a heat pipe and a fan. Each of the heat dissipation fins includes a plate and an air guiding body. The plate has a thermal contact side used for being in thermal contact with the heat source. An acute angle is formed between an extension side of the air guiding body and the thermal contact side. The heat pipe penetrates through the plates. The fan used for forming an air current is installed at a side of the heat dissipation fin opposite to the thermal contact side. The air guiding body and the heat pipe are disposed in a flowing path of the air current. Thereby, the air current is guided toward the heat pipe and the amount of air flowing through the heat pipe is increased.

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Patent Owner(s)

Patent OwnerAddress
MSI COMPUTER (SHENZHEN) CO LTD518108 GUANGDONG CITY OF SHENZHEN PROVINCE SHIYAN TOWN TANGTOU VILLAGE LONGMA INFORMATION TECHNOLOGY INDUSTRIAL PARK SHENZHEN CITY GUANGDONG PROVINCE 518108

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIN, Yi-Kun New Taipei City, TW 3 12
YANG, Shang-Chih New Taipei City, TW 10 73

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