HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE WITH THE SAME
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Nov 30, 2012
filing date -
Oct 25, 2012
priority date (Note) -
Abandoned
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Abstract
A heat dissipation module comprises a radiator. The radiator comprises a first fin assembly and a second fin assembly. The first fin assembly comprises a plurality of first fins arranged abreast of each other, and the first fin assembly has a first average distribution density. The second fin assembly comprises a plurality of second fins arranged abreast of each other, and the second fin assembly has a second average distribution density. The second average distribution density is larger than the first average distribution density.
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