HEAT SINK APPLICABLE FOR ELETROMAGNETIC DEVICE
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Mar 15, 2013
filing date -
Oct 25, 2012
priority date (Note) -
Abandoned
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Abstract
The present disclosure provides a heat sink applicable for electromagnetic device comprises a first panel, a second panel, and a plurality of supporting structures connecting with the first panel and the second panel. Wherein the first panel, the second panel and the supporting structures together constitute a plurality of medium channels for cooling medium flowing therethrough. Wherein at least some of the medium channels are provided with openings formed on the first and/or second panels, and no close conductive loop is formed on cross section perpendicular to a medium flowing direction of the medium channels with the openings. Wherein a total area of all openings on the first panel is less than 50% of an area of the first panel, a total area of all openings on the second panel is less than 50% of an area of the second panel.
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