Adhesive Composition, Bonding Method Using Adhesive Composition, and Separation Method After Bonding
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United States of America Patent
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Issued Date -
May 1, 2014
app pub date -
Oct 24, 2013
filing date -
Oct 25, 2012
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Abandoned
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Abstract
An adhesive composition according to the present invention contains a polymerizable group-containing siloxane compound, a polymerization initiator and an ultraviolet-absorbing blowing agent. This adhesive composition enables quick bonding of substrates etc. by light irradiation or by heating such that the bonded substrates can secure adhesion and heat resistance to withstand grinding etc. and, when no longer needed to be bonded, can be easily separated from each other by ultraviolet light irradiation and is thus suitable for use as an adhesive composition for manufacturing of semiconductor devices (particularly for manufacturing of semiconductor devices with through-silicon vias).
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