POLISHING HEAD AND POLISHING APPARATUS
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United States of America Patent
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Issued Date -
Apr 24, 2014
app pub date -
May 31, 2012
filing date -
Jun 29, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing head comprising an annular rigid ring; a rubber film attached to the rigid ring by using uniform tensile force; a back plate that is connected to the rigid ring and forms a space portion with the rubber film and the rigid ring; and an annular template that is provided at a peripheral portion of a lower surface portion of the rubber film concentrically with the rigid ring and configured to hold an edge portion of a workpiece, the polishing head holding a back surface of the workpiece on the lower surface portion of the rubber film and sliding a front surface of the workpiece on a polishing pad attached to a turn table to perform polishing. The polishing head and the polishing apparatus can be used for final polishing and uniformly polish the entire front surface regardless of the thickness of the template.
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