FAN ASSEMBLING STRUCTURE AND HEAT DISSIPATING DEVICE
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United States of America Patent
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Issued Date -
Apr 24, 2014
app pub date -
Mar 18, 2013
filing date -
Oct 23, 2012
priority date (Note) -
Abandoned
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Abstract
The invention provides a fan assembling structure and a heat dissipating device. The fan assembling structure comprises a first assembling board for assembling a fan thereon and a second assembling board connected to the first assembling board, the fan comprising a frame and blades disposed in the frame assembled to the first assembling board, the frame having an upper board, a lower board and a circular connector connected between the upper board and the lower board, the lower board including a first side edge, a second side edge, a third side edge and a fourth side edge in sequential connection.
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