POLISHING PAD, POLISHING APPARATUS, AND METHOD FOR MAKING THE POLISHING PAD

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United States of America Patent

SERIAL NO

14056709

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Abstract

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The present invention relates to a polishing pad comprising a polishing surface. The polishing surface comprises a first polishing area and a second polishing area. The first polishing area comprises a plurality of first foaming holes, and the second polishing area comprises a plurality of second foaming holes, and an average pore diameter of the first foaming holes is less than an average pore diameter of the second foaming holes. The polishing pad according to the present invention uses the polishing areas with the different pore diameters of the holes to avoid unevenly removing the edge and central part of a substrate when polishing, so that a thickness of the substrate becomes uniform.

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Patent Owner(s)

Patent OwnerAddress
SAN FANG CHEMICAL INDUSTRY CO LTD402 FENGJEN RD JENWU DIST KAOHSIUNG CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FENG, CHUNG-CHIH KAOHSIUNG CITY, TW 112 308
HUNG, YUNG-CHANG KAOHSIUNG CITY, TW 45 119
TSAI, KUN-CHENG KAOHSIUNG CITY, TW 19 139
YAO, I-PENG KAOHSIUNG CITY, TW 79 189

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