SEED COATING FORMULATION SYSTEMS

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United States of America Patent

SERIAL NO

14054099

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Abstract

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The present invention provides seed coating systems and methods for their use, where a seed coating system comprises encapsulated active ingredient particles that comprise an active ingredient and an encapsulation layer with a preselected release profile, and a polymeric seed coating, wherein the polymeric seed coating releasably affixes the encapsulated active ingredient particle in proximity to a surface of a seed. In embodiments, the seed coating system comprises a plurality of active ingredient layers, wherein a first active ingredient layer comprises a first encapsulated active ingredient, wherein the first encapsulated active ingredient is encapsulated in a first polymer, and wherein the polymer comprises a first binding site that binds the active ingredient and a second binding site for binding to a delivery area, and a binder to releasably affix the encapsulated active ingredient to at least one of a seed surface or a second active ingredient layer, and wherein a second active ingredient layer comprises a second encapsulated active ingredient, wherein the second encapsulated active ingredient is encapsulated in a second polymer which may be the same as or different from the first polymer, and a binder to releasably affix the encapsulated active ingredient to at least one of the first active ingredient layer and a subsequent active ingredient layer.

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Patent Owner(s)

Patent OwnerAddress
CROP ENHANCEMENT LLC35 SPINELLI PLACE CAMBRIDGE MA 02138

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jogikalmath, Gangadhar Cambridge, US 56 587
Schneider, Andrea Hyde Park, US 13 62
Soane, David S Chestnut Hill, US 253 7662

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