INORGANIC POLYSILAZANE, SILICA FILM-FORMING COATING LIQUID CONTAINING SAME, AND METHOD FOR FORMING SILICA FILM

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United States of America Patent

APP PUB NO 20140106576A1
SERIAL NO

14113305

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Abstract

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Disclosed is an inorganic polysilazane that undergoes less shrinkage during a calcination step in an oxidizing agent such as water vapor and is less prone to allow a silica film to suffer from the formation of cracks or peel off from a semiconductor substrate, and a silica film-forming coating liquid containing the inorganic polysilazane, and also provides an inorganic polysilazane and a silica film-forming coating liquid containing the same. The value of A/(B+C) is 0.9-1.5 and the value of (A+B)/C is 4.2-50. A=peak area within the range of from 4.75 ppm to less than 5.4 ppm. B=peak area within the range of from 4.5 ppm to less than 4.75 ppm. Peak area within the range of from 4.2 ppm to less than 4.5 ppm is represented by C in a 1H-NMR spectrum; and the polystyrene-equivalent mass average molecular weight is 2000 to 20000.

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Patent Owner(s)

Patent OwnerAddress
ADEKA CORPORATIONARAKAWA-KU TOKYO 116-8554

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furihata, Yasuhisa Tokyo, JP 2 12
Kobayashi, Atsushi Tokyo, JP 449 5864
Morita, Hiroshi Tokyo, JP 288 2084
Yokota, Hiroo Tokyo, JP 2 11

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