MATERIAL FOR PROVIDING AN ELECTRICALLY CONDUCTING CONTACT LAYER, A CONTACT ELEMENT WITH SUCH LAYER, METHOD FOR PROVIDING THE CONTACT ELEMENT, AND USES OF THE MATERIAL
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United States of America Patent
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Issued Date -
Apr 17, 2014
app pub date -
Feb 9, 2012
filing date -
Feb 9, 2011
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Abstract
A material for providing an electrically conducting contact layer, the material comprising a base material being any one of Ag, Cu, Sn, Ni, a first metal salt of one thereof, or an alloy of one or more thereof. The material further comprises In within a range of 0.01 at. % to 10 at. %, Pd within a range of 0.01 at. % to 10 at. %, and, unless already the base material comprises Sn at a higher amount, Sn within a range of 0.01 at. % to 10 at. %. From such material, a contact layer (6) can be provided that, compared to a coating of only the base material, has improved corrosion resistance and low contact resistance. Also disclosed is: an electrically conducting contact element (2) that comprises a substrate (4) and coated thereon a contact layer (6) comprising the material, a method for providing the contact element (2), and uses of the material as contact layer and target material.
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