POLISHING HEAD, POLISHING APPARATUS, AND METHOD FOR POLISHING WORKPIECE
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United States of America Patent
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Issued Date -
Apr 17, 2014
app pub date -
May 28, 2012
filing date -
Jun 21, 2011
priority date (Note) -
Abandoned
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Abstract
A polishing head configured to hold a workpiece at the time of polishing the workpiece by bringing a front surface of the workpiece into sliding contact with a polishing pad attached to on a turn table, the polishing head includes: a workpiece-holding board configured to hold a back surface of the workpiece, the workpiece-holding board being flexible and being composed of ceramics; a sealed space defined on a surface of the workpiece-holding board on an opposite side of a surface on which the workpiece is held; and a pressure-controlling device configured to control a pressure in the sealed space, the polishing head being capable of adjusting a shape of the flexible workpiece-holding board into a convex shape or a concave shape by controlling a pressure in the sealed space by the pressure-controlling device.
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