Block copolymer assembly
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United States of America Patent
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Dec 16, 2014
Grant Date -
Apr 10, 2014
app pub date -
Oct 5, 2012
filing date -
Oct 5, 2012
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Abstract
The embodiments disclose a block copolymer assembly structure, including a first pattern and second pattern with a first density of patterned features integrated in data and servo zones, a silicon substrate with thin film layers deposited thereon and patterned using the first density of first pattern and second pattern features and a template fabrication pattern with a second density greater than the first density created using ordered block copolymer periodic structures across a portion of the substrate.
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