INTEGRATED CIRCUIT PACKAGE
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United States of America Patent
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Issued Date -
Apr 10, 2014
app pub date -
Feb 28, 2013
filing date -
Oct 8, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit package and a manufacturing method thereof are provided. The integrated circuit package can include a substrate provided with a circuit pattern, a first set of bonding fingers and a second set of bonding fingers, a first chip stack mounted on the substrate and having a plurality of first semiconductor chips stacked in a first direction in a stepped manner, each of the first semiconductor chips being provided with a first bonding pad at an end thereof on one side, a second chip stack mounted on the first chip stack and having a plurality of second semiconductor chips stacked in a second direction opposite to the first direction in a stepped manner.
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