PROXIMITY SENSOR AND CIRCUIT LAYOUT METHOD THEREOF
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United States of America Patent
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Issued Date -
Apr 10, 2014
app pub date -
Sep 27, 2013
filing date -
Oct 4, 2012
priority date (Note) -
Abandoned
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Abstract
A proximity sensor and a circuit layout method thereof are disclosed. The proximity sensor includes a light sensor and a light emitting unit. The light sensor includes a semiconductor substrate and a bonding pad. The semiconductor substrate has a first circuit region. At least one semiconductor device is disposed in the first circuit region. The bonding pad is disposed above the first circuit region and a gap is existed between the bonding pad and the at least one semiconductor device. The bonding pad is connected to the semiconductor substrate out of the first circuit region. The light emitting unit is disposed on the bonding pad of the light sensor.
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