METHOD OF FORMING A TRANSPARENT CONDUCTIVE LAYER ON A SUBSTRATE
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United States of America Patent
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Issued Date -
Apr 10, 2014
app pub date -
Oct 2, 2013
filing date -
Oct 5, 2012
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Abandoned
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Abstract
The present invention provides a method of forming a transparent conductive layer on a substrate, including: applying a conductive composition containing a conductive polymer onto the substrate to form the transparent conductive layer thereon, forming a patterned protection layer on the transparent conductive layer to define a transparent conductive layer region covered by the protection layer and a transparent conductive layer region not covered by the protection layer; performing a wet etching process on the transparent conductive layer region not covered by the protection layer; and removing the protection layer, wherein an annealing process is performed on the transparent conductive layer before or after the wet etching process. The method of the present invention can reduce the chromatic aberration between the etched transparent conductive layer and the un-etched transparent conductive layer. Moreover, since the present invention does not utilize an additional optical layer to eliminate the chromatic aberration, the method of the present invention would be simpler and more economically attractive compared to the conventional ones.
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