WIRING SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Apr 10, 2014
app pub date -
Sep 26, 2013
filing date -
Oct 5, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wiring substrate includes a first wiring layer, a first insulating layer, a second wiring layer, and a first wiring pattern. The second wiring layer includes a first metal foil that is thinner than the first wiring layer. A first via in the first insulating layer connects the first and second wiring layers. The first via is arranged to fill a first through hole and a first recess. The first through hole extends through the first insulating layer and has a first open end with a first opening diameter and a second open end with a smaller second opening diameter. The first recess is in communication with the first through hole. The first recess has a larger diameter than the second opening diameter. The first metal foil includes a first opening communicating with the first through hole and having a larger opening diameter larger than the first opening diameter.
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