HEAT EXCHANGER

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United States of America Patent

APP PUB NO 20140096944A1
SERIAL NO

14044057

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat exchanger having an improved distribution structure in which one inlet pipe is connected to a header which is partitioned into a first sub-chamber in which a refrigerant flows through the inlet pipe and a second sub-chamber in which tubes communicate with each other, and a distribution pipe is installed at the header and causes the first sub-chamber and the second sub-chamber to communicate so that the refrigerant in the first sub-chamber can be distributed to the tubes. The distribution pipe can pass through and can be combined with a partitioning baffle that is combined with the header to partition a chamber of the header into the first sub-chamber and the second sub-chamber.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baek, Yong Ki Cheonan-si, KR 3 17
Gaku, Hayase Suwon-si, KR 14 61
Ha, Seung Hee Busan, KR 5 228
SEO, Kang Tae Suwon-si, KR 13 63

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