Method of Hybrid Stacked Chip for a Solar Cell

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United States of America Patent

SERIAL NO

14089864

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Abstract

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A method of hybrid stacked Chip for a solar cell onto which semiconductor layers of different materials is provided by stacking tunnel layer and bumps in order to solve the problem of lattices mismatch between the layers for further increasing of the efficiency of solar cell. Electric charges (i.e., current) generated by respective solar cells can be outputted by means of contacts. Further total power P is defined by a summation of powers of respective solar cells, i.e., V1I1+V2I2+ . . . VnIn. This is a great increase in comparison with the power of conventional solar cells connected in series.

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Patent Owner(s)

Patent OwnerAddress
CHANG GUNG UNIVERSITY259 WEN-HWA 1ST ROAD KWEI-SHAN TAO-YUAN 333 R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Liann-Be Taoyuan County, TW 41 128
Lee, Yu-Lin Tainan City, TW 24 159

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