ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE
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United States of America Patent
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Issued Date -
Apr 3, 2014
app pub date -
Mar 15, 2013
filing date -
Oct 3, 2012
priority date (Note) -
Abandoned
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Abstract
The electromagnetic interference shielding structure disclosed comprises a first metal layer, a second metal layer, a dielectric layer inter-disposed between the first metal layer and the second metal layer, an adhesive layer located on the second metal layer, and a release film located on the adhesive layer. The electromagnetic interference shielding film prevent the neighbouring circuits and components from the electromagnetic wave interference, the theories applied are reflections of the electromagnetic waves, and absorption of the electromagnetic waves.
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