COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20140092638A1
SERIAL NO

14010836

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Abstract

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An AlGaN/GaN.HEMT includes: a compound semiconductor layered structure; and an interlayer insulating film that covers a surface of the compound semiconductor layered structure, the interlayer insulating film including a first insulating film and a second insulating film that is formed on the first insulating film to fill irregularities on a surface of the first insulating film and has a flat surface.

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Patent Owner(s)

Patent OwnerAddress
TRANSPHORM JAPAN INCSHIN-YOKOHAMA CENTER BLDG 9F 2-5-15 SHIN-YOKOHAMA KOHOKU-KU YOKOHAMA KANAGAWA 222-0033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishimori, Masato Atsugi, JP 26 202
WATANABE, Yoshitaka Aidumisato, JP 89 1670

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