SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20140091320A1
SERIAL NO

13968843

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Abstract

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A semiconductor device includes a first semiconductor layer formed on a substrate, a second semiconductor layer formed on the first semiconductor layer, a third semiconductor layer and a fourth semiconductor layer formed on the second semiconductor layer, a gate electrode formed on the third semiconductor layer, and a source electrode and a drain electrode contacting and formed on the fourth semiconductor layer, wherein the third semiconductor layer is formed of a semiconductor material for attaining p-type on an area just under the gate electrode, and a concentration of silicon in the fourth semiconductor layer is higher than that in the second semiconductor layer.

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Patent Owner(s)

Patent OwnerAddress
TRANSPHORM JAPAN INCSHIN-YOKOHAMA CENTER BLDG 9F 2-5-15 SHIN-YOKOHAMA KOHOKU-KU YOKOHAMA KANAGAWA 222-0033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imanishi, Kenji Atsugi, JP 81 1651
Ishiguro, Tetsuro Kawasaki, JP 28 140
KOTANI, JUNJI Isehara, JP 50 240
NAKAMURA, NORIKAZU Sagamihara, JP 63 992
Yamada, Atsushi Isehara, JP 406 3161

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