IN-MOLD LABEL AND METHOD FOR PRODUCING THE SAME

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United States of America Patent

SERIAL NO

14093573

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Abstract

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Provided is an in-mold label and a method for producing the in-mold label which has a heat-sealable resin layer with a plurality of interlaced and continuous-arranged micro-protrusions. While the in-mold label is combined on a surface of a specific article, the micro-protrusions may provide multiple blister-exhausting paths. As a result, it is effective to drive out the blisters as combining the label and the article. The in-mold label particularly includes a substrate made of a thermoplastic resin material, a printed layer on the substrate's one surface, and the other surface made of heat-sealable resin. With an embossing process, the heat-sealable resin layer having the interlaced and continuous-arranged micro-protrusions is formed. The in-mold label can be sealed to the article surface excellently since the micro-protrusions form the multiple paths for exhausting the blisters effectively.

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Patent Owner(s)

Patent OwnerAddress
NAN YA PLASTICS CORPORATIONNO 380 SEC 6 NANJING E RD NEIHU DIST TAIPEI CITY 114030

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHENG, HONG KUO TAIPEI, TW 4 5
LIN, ALLEN FC TAIPEI, TW 2 2

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