COMPOUND DIELECTRIC ANTI-COPPER-DIFFUSION BARRIER LAYER FOR COPPER CONNECTION AND MANUFACTURING METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 27, 2014
app pub date -
Jun 18, 2013
filing date -
Sep 25, 2012
priority date (Note) -
Abandoned
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
The disclosure belongs to the field of manufacturing and interconnection of integrated circuits, and in particular relates to compound dielectric anti-copper-diffusion barrier layer for copper interconnection and a manufacturing method thereof The disclosure uses compound dielectric (oxide & metal) as the anti-copper-diffusion barrier layer. First, it can enhance the capable of metal for anti-copper-diffusion efficiently, and prevent the barrier layer for valid owing to oxidized and prolong the life of the barrier layer. Second, it can reduce the effective dielectric constant of the interconnection circuits and furthermore reduce the RC delay of the whole interconnection circuits. Besides, the alloy is firmly adhered to the copper, and the metal copper can be directly electroplated without growing a layer of seed crystal copper. The method is simple and feasible and is expected to be applied to manufacturing of the anti-copper-diffusion barrier layers for copper interconnections.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
FUDAN UNIVERSITY | 200433 NO 220 HANDAN ROAD SHANGHAI YANGPU DISTRICT SHANGHAI CITY SHANGHAI CITY 200433 |
International Classification(s)

- 2013 Application Filing Year
- H01L Class
- 22267 Applications Filed
- 20713 Patents Issued To-Date
- 93.03 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Fang, Runchen | Shanghai, CN | 6 | 61 |
# of filed Patents : 6 Total Citations : 61 | |||
Sun, Qingqing | Shanghai, CN | 42 | 238 |
# of filed Patents : 42 Total Citations : 238 | |||
Wang, Pengfei | Shanghai, CN | 172 | 398 |
# of filed Patents : 172 Total Citations : 398 | |||
Zhang, Wei | Shanghai, CN | 2625 | 19909 |
# of filed Patents : 2625 Total Citations : 19909 | |||
Zheng, Shan | Shanghai, CN | 3 | 3 |
# of filed Patents : 3 Total Citations : 3 | |||
Zhou, Peng | Shanghai, CN | 284 | 6195 |
# of filed Patents : 284 Total Citations : 6195 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 3 Citation Count
- H01L Class
- 7.09 % this patent is cited more than
- 11 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 27, 2025 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
- growing the production organism in the presence of a fermentable carbon source whereby one or more polyunsaturated fatty acids are produced, and optionally recovering the one or more polyunsaturated fatty acids.

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Aug 12, 2024 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 8TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2552); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY year of fee payment: 8 |
Aug 11, 2020 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2551); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY year of fee payment: 4 |
Feb 21, 2017 | I | Issuance | |
Feb 01, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Dec 03, 2016 | FEPP | FEE PAYMENT PROCEDURE | free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
Jan 21, 2016 | P | Published | |
Jul 29, 2015 | F | Filing | |
May 31, 2010 | PD | Priority Date |

Matter Detail

Renewals Detail
