COMPOUND DIELECTRIC ANTI-COPPER-DIFFUSION BARRIER LAYER FOR COPPER CONNECTION AND MANUFACTURING METHOD THEREOF

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United States of America Patent

APP PUB NO 20140084472A1
SERIAL NO

13920637

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure belongs to the field of manufacturing and interconnection of integrated circuits, and in particular relates to compound dielectric anti-copper-diffusion barrier layer for copper interconnection and a manufacturing method thereof The disclosure uses compound dielectric (oxide & metal) as the anti-copper-diffusion barrier layer. First, it can enhance the capable of metal for anti-copper-diffusion efficiently, and prevent the barrier layer for valid owing to oxidized and prolong the life of the barrier layer. Second, it can reduce the effective dielectric constant of the interconnection circuits and furthermore reduce the RC delay of the whole interconnection circuits. Besides, the alloy is firmly adhered to the copper, and the metal copper can be directly electroplated without growing a layer of seed crystal copper. The method is simple and feasible and is expected to be applied to manufacturing of the anti-copper-diffusion barrier layers for copper interconnections.

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Patent Owner(s)

Patent OwnerAddress
FUDAN UNIVERSITY200433 NO 220 HANDAN ROAD SHANGHAI YANGPU DISTRICT SHANGHAI CITY SHANGHAI CITY 200433

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  • 2013 Application Filing Year
  • H01L Class
  • 22267 Applications Filed
  • 20713 Patents Issued To-Date
  • 93.03 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2013201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fang, Runchen Shanghai, CN 6 61
Sun, Qingqing Shanghai, CN 42 238
Wang, Pengfei Shanghai, CN 172 398
Zhang, Wei Shanghai, CN 2625 19909
Zheng, Shan Shanghai, CN 3 3
Zhou, Peng Shanghai, CN 284 6195

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  • 3 Citation Count
  • H01L Class
  • 7.09 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges7625916189582342423416712683684320001 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0500100015002000250030003500400045005000550060006500

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