PACKAGE STRUCTURE FOR SUBSTRATE STORAGE CONTAINER
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United States of America Patent
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N/A
Issued Date -
Mar 27, 2014
app pub date -
Dec 19, 2012
filing date -
Sep 27, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package structure used to load substrate storage containers for convenience of transportation is revealed. The package structure includes a package box and at least one buffer pad. The buffer pad is disposed in the package box and used for loading a substrate storage container. The density of the buffer pad is smaller than 70 kg/m3. The buffer pad not only separates the package box from the substrate storage container but also absorbs vibration from outside of the package box so as to prevent the vibration from being transmitted to the substrate storage container completely. The amount of vibration that has an impact on the substrate storage container is reduced.
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