SERIAL PLATING SYSTEM
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United States of America Patent
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Issued Date -
Mar 27, 2014
app pub date -
Sep 25, 2012
filing date -
Sep 25, 2012
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Abstract
A serial plating system includes a plurality of nozzles that are disposed in a plating tank at a position opposite to a plurality of workpieces, and that discharge a plating solution toward the plurality of workpieces, and a plurality of anodes that are disposed in the plating tank at a position opposite to the plurality of workpieces that are serially transferred in the plating tank, one nozzle among the plurality of nozzles and at least one anode among the plurality of anodes being alternately and repeatedly disposed along a transfer direction in which the plurality of workpieces are serially transferred. The plurality of nozzles and the plurality of anodes may be disposed to overlap in a side view along the transfer direction.
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