CONDUCTIVE PATTERN FORMATION
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United States of America Patent
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Issued Date -
Mar 27, 2014
app pub date -
Dec 3, 2013
filing date -
Jun 21, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.
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