SOLDERING PASTE FLUX AND SOLDERING PASTE
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United States of America Patent
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Issued Date -
Mar 27, 2014
app pub date -
Oct 7, 2011
filing date -
May 25, 2011
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Abstract
The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.
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