METHOD OF REMOVING IMPURITIES FROM PLATING LIQUID
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United States of America Patent
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Issued Date -
Mar 27, 2014
app pub date -
Sep 24, 2012
filing date -
Sep 24, 2012
priority date (Note) -
Abandoned
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Abstract
Impurities are removed from tin plating liquids by adding additives containing aromatic organic sulfonic acids or salts thereof to the tin plating liquids containing nonionic surface active agents and thiourea or thiourea compounds and producing a precipitate by cooling.
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