Die Bonder and Method of Position Recognition of Die
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United States of America Patent
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Issued Date -
Mar 20, 2014
app pub date -
Feb 28, 2013
filing date -
Sep 18, 2012
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Abandoned
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Abstract
A die bonder comprises a storage unit which stores the image of the wafer taken by an imaging unit, a recognition pattern included the outline of a die formed on the wafer, and a recognition program, and a monitor-processing unit which gets the position on the wafer, of the die whose map data indicates normal, in the way that the die is matched with the recognition pattern by executing the recognition program, and that the center position of the die is gotten.
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