ORGANIC LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND METHOD OF MANUFACTURING CONCAVITY ON SUBSTRATE
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United States of America Patent
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Issued Date -
Mar 20, 2014
app pub date -
Sep 14, 2013
filing date -
Sep 14, 2012
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Abandoned
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Abstract
The present invention provides an organic light-emitting diode package structure including a first substrate, a second substrate, at least an organic light-emitting diode device and a dam. The first substrate and a surface of the second substrate are disposed opposite to each other, wherein the surface of the second substrate includes a plurality of concavities, each of the concavities has an opening area, and a ratio of a sum of the opening areas of the concavities to an area of the first surface of the second substrate is substantially between 0 and 1. The organic light-emitting diode device is disposed on the first substrate, and a light emitting surface of the organic light-emitting diode device faces the second substrate. The dam is disposed between the first substrate and the second substrate to combine the first substrate and the second substrate, and the dam surrounds the organic light-emitting diode device.
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