BIDIRECTIONAL HEAT DISSIPATION STRUCTURE
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United States of America Patent
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Issued Date -
Mar 20, 2014
app pub date -
Sep 20, 2012
filing date -
Sep 20, 2012
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Abandoned
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Abstract
A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly.
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