REMOVING RESIDUES FROM SUBSTRATE PROCESSING COMPONENTS
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United States of America Patent
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app pub date -
Nov 22, 2013
filing date -
Oct 19, 2006
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Abstract
Residues are removed from a surface of a substrate processing component which has a polymer coating below the residues. In one version, the component surfaces are contacted with an organic solvent to remove the residues without damaging or removing the polymer coating. The residues can be process residues or adhesive residues. The cleaning process can be conducted as part of a refurbishment process. In another version, the residues are ablated by scanning a laser across the component surface. In yet another version, the residues are vaporized by scanning a plasma cutter across the surface of the component.
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